Mechanical study of interfaces in printed circuit boards - Towards a better reliability of PCBs – EMICI

The current trend for increased capabilities and miniaturization leads to manufactured goods composed of materials showing very heterogeneous mechanical properties. The exposition of these assemblies to thermal loadings during manufacturing or during use induce reliability issues. In this project, printed circuit boards (PCBs) are considered, for they are the ideal multi-material product for the fundamental research in mechanics of materials. Delamination between the constitutive layers is a source of reliability issues in PCBs, and constitutes the topic of this project. After having characterized the mechanical behavior of the different layers involved, the response of the interfaces will be studied at different loading rates and temperatures. For this purpose, new measurement methods will be developed. Furthermore, the measurements and modeling steps achieved will allow to offer predictive simulations to the PCB industry, therefore improving the reliability of the products.