Use of 3D-printing for functionnal packaging and multitechnology integration dedicated to RF electronic – TANGO

The need for miniaturization of electronics has become paramount in relation to the evolution of the markets in the fields of defense, space, automotive, medicine but also aeronautics. In order to follow the evolution of the electronics of the future, it is compulsory to put actions in place to meet emerging needs and avoid evasion towards other continents of the technological basics of embedded electronics.

The TANGO project will focus on a high added-value market : microwaves. The requirements for RF and microwave systems turn out to be higher and higher given the recurrent constraints of optimal exploitation of spectral resources, therefore, electronic equipment must adapt itself.

In this TANGO project we propose to develop new co-integration techniques allowing to realize complex modules applied to 2 and 3D elements. For instance, we want to integrate 3D-printed elements on the PCB surface or integrate microwave functions inside 3D printed parts. The objective is to show the interest of the contribution of 3D printing in the development of functional packaging and for multi-technology integration in RF electronics.

The strategic contract for the electronics industry (2018-2022) presented by the french government in March 2019 specifies that it is important to master basic technologies since they are at the electronics value chain origin, the TANGO project is fully in line with this strategy.

This project aims to address the production of innovative components for the improvement of microwave and communication chains, and the use of additive manufacturing for the production of high-performance 3D electronic modules.

TANGO is a 36-month applied research project that will address two objectives.
- The first one concerns topological optimization of microwave components by coupling conventional planar technology and 3D-printed waveguide technology. This association enables to free up the design constraints linked to printed circuits manufacturing and to move it on to PCB / 3D-printing association, and by doing so fully exploit the third dimension. To achieve this objective, we will rely on the advantage of additive manufacturing techniques which make possible the production of inexpensive innovative components, unlike conventional subtractive technologies.
- The second objective concerns integration and miniaturization of the devices. The challenge here is to integrate functions, SMD components or integrated circuits into 3D-printed blocks. This fully additive encapsulation would replace a wire link. This method is already under study for multilayer printed circuits, but this technology is limited regarding the number and density of reported elements. The use of additive manufacturing makes possible the release of technological constraints but also creates new 2D / 3D interconnections, while maintaining reduced costs.
To achieve these objectives, the consortium is made up of 4 partners, the lab-STICC (University of Brest) academic laboratory, two SMEs, Elliptika and Protecno and a large group: THALES. This Consortium is complementary and covers the defense-oriented needs, from research to implementation. In addition, and to assess the impact of the solutions proposed, the consortium will also take into consideration civil sector objectives through an end user related to the automotive sector.