High Temperature ThermoElectric Generator – HITTEG

The main goal will be to propose a HITTEG technology to manufacture low cost, thermal conductive anisotropic frame for high temperature TEG’s based on the convergence of ceramic tape process and powder injection molding (PIM). In fact to reach such scope, the main objectives of HITTEG project are:
- To develop suitable ceramic tape with controlled solid content and low thermal conductivity (approx. 0.5W/mK)
- To develop high thermal conductive feedstocks for PIM (>20 W/mK) after sintering.
- To develop convergent processes based on the hybridization of injection mold process with tape insertion.
- Layer-design: To manufacture anisotropic 3 layered ceramics large surface frames for TEG application based on the HITTEG convergent process. This frame will be formed by a bulk injected by CIM and both skins made by the multilayered tape labeling
- Compact-design: To manufacture microstructured components of high thermal conductive material (metal and one ceramic as alternative) equipped with a low thermal conductive layer. The singular components will be partially covered with thermoelectric material and subsequently the whole staple will be assembled in a frame (Fig. 3).
- To launch the business plan of the advanced HITTEG process and thermoelectric component.

This thermoelectric component frame is composed of a skin tapes which will have high thermal conductivity while bulk will have a low thermal conductivity.