Contacts électro-thermo-mécaniques innovants pour les systèmes et l'électronique de puissance intégrée à grande échelle – ECLIPSE

Electrical efficiency relies on highly integrated designs of electronic devices especially power converters. Topological and functional evolutions involve new power conversion architectures. Especially, packaging must be designed in 3D and in a compact manner while enabling operation in severe conditions (in terms of electro-thermo-mecanical stresses). As a consequence, it is necessary to reinvest material and die attach issues at the component level and especially at the contact and metallization levels. Today trends are engaged toward multi-functional active power dies which drives us toward the packaging of double side and multi potential power devices. This problematic, yesterday partially solved thanks to solder bumps or even wire-bond, is not satisfying today requirements in terms of electrical parasitics, thermal heat removal capability per square cm or mechanical duration and reliability. As a result, new techniques are under investigation to fulfill the lack of technical solutions and in order to widen operation conditions and performances of electro-thermo-mecanical contacts for active power device and architectures. It is the aim of this project to focus of technological development of ETM contacts and then, to carry out a full electro-thermo-mecanical characterization of them. As a result, it is necessary to : - to innovate in terms of die attach and electrical contacts of double side and/or multi power potential active components in integrated power electronics through a coupled technological search in terms of electrical, thermal and mechanical contact functionalities. In this direction, the project concentrates the research activity carried out in three different electrical engineering French laboratories coupling their technological and characterization expertise among them with a fourth lab for its expertise in terms of reliability and characterization procedures. - To study, to analyze and to evaluate the news techniques and materials that will solve the contact problems raised by the evolution of power dies and their operating environments. The laboratories will develop characterization test benches in their own domain of expertise. Ampere lab will have in charge the development of the electrical characterization test bench while G2ELab will have in charge the characterization of thermal performances of the developed technical solutions. LTN will have in charge all reliability and mechanical characterization At the end, the labs will federate a full characterization test bench for the study, the analysis and the characteristics comparisons of ETM contact for power devices dedicated to operation in severe conditions. - First, the characterization benches will be used to study and compare the technological developments conducted during the project. Results will be compared to the state of the art, especially Bump technology, which at the time of the project is considered as the most advance technological process for 3D packaging. In order to maximize comparisons and possible analysis, common and dedicated dies will be designed. These dies will allow us to investigate and to tune the metallization and surface terminations as a function of contact requirements. In addition, the dies will be made to allow severe test conditions without impacting on the characterization of the ETM contacts. Finally, they will be made to allow specific surface layout and specific active heat locations. As a summary, five efforts will be engaged in this project : -An effort in terms of technological development in order to fulfill the lack of technological solutions of ETM contact for future multifunctional power devices operating in severe environments, -An effort in finding the best compliance among the power die metallization, the surface terminations and the techniques for ETM contacts, -An effort in terms of full test bench characterization of ETM contacts through the expertise available and developed in our electrical engineering community, -An effort in terms of full ETM characterization of the technological development conducted in the project, -An effort in terms of structuration of a community that will be able to look for answers for technological development and characterization of ETM contacts for up coming power devices and their operation in severe environments.