Advanced MEtalLIZation Strategies for Heterojunction Solar Cells – AMELIZ

The AMELIZ project sees in copper (Cu) a perfect alternative to Ag: the project aims to demonstrate and engineer the key materials and mechanisms governing plating selectivity as well as grid performance and reliability, focusing on technical routes enabling for low cost integration into SHJ solar cells. Highly conductive material and hundred times cheaper than Ag, Cu is a promising candidate to boost solar cell efficiency and take part in the final reduction of the Levelized Cost of Energy (LCOE).
The technological challenges consist in reaching precise patterned structures without parasitic-ghost plating, which demonstrate a high adhesion to the cell TCO, a low contact resistance, a high line conductance, as well as minimum shading (< 30 µm line width). With a very strong base coming from SHJ cells mastered at CEA/INES and from high-level plating process flow demonstrated at CSEM, the project partners will develop low cost seed layer approaches and innovative patterning processes, providing advanced solutions that will permit to surpass the current cost barrier. Mastering of selective plating mechanisms and approaches will be key to localize fine and conductive lines. Understanding of electrical and metallurgic contact properties in between the TCO and the metal will be key to improve the performance of the device, in parallel with mechanical resistance and chemical compatibility. The AMELIZ project offers partners with world-reknown expertise and knowledge to address this advanced metallization topic with highly innovative solutions: CSEM, CEA (INES and LETI) and the CNRS-LN2 and the collaboration of RISE, small company in Italy.