FRActure Intitiation and Dynamics in SmartCut Process – Fraindy

The project aims at understanding the physics underlying the rupture of single crystal
materials (namely Silicon) induced by light gas ion implantation (the “Cut” stage of the
SmartCut™ technology). We will use and develop a variety of experimental techniques
allowing quantitative measurements of size, number, strain extent and gas content of microcracks
produced by implantation and annealing. The collective and statistical behavior of the
cracks induced by gas precipitation will be followed carefully to understand the collective
growth and coalescence kinetics of microcracks (Obj.1). From these studies, the energetics of the system will
be addressed and we will try to understand through mechanical test experiments how and
when the wafer-scale crack propagation/film delamination is triggered (Obj.2). Finally, the
dynamics of the crack propagation at the wafer scale will be studied, with different issues as
e.g. elastic waves emission and its impact on the fracture path, hence on post-slit surface
roughnesses (Obj.3). Results will be modeled using tools from elasticity, mechanics, thermodynamics and statistical physics.