New line of high density plasmas with extended operating conditions : etching chamber prototype – APANAGE

The objective of the APANAGE project is to exploit recent results of fundamental research obtained in the PLASMODIE ANR "blanc" project (2006-2009) devoted to the development of new plasma sources. The performance achieved in terms of plasma density, extension of operating conditions (pressure, microwave frequency, microwave power), plasma scaling up capabilities have brought them decisive and competitive advantages as compared to conventional existing sources (capacitively coupled or inductively coupled plasma sources) for surface treatment (e.g. etching). However, if the concepts behind this new generation of plasma sources have been completely validated within PLASMODIE project, additional studies on technological developments are needed in order to reach marketable processes and products.

In order to reach this objective of technology transfer, the APANAGE project therefore proposes to develop all industrial solutions that lead to the realization of a chamber that can be installed, in substitution of existing plasma chambers for plasma etching, on the basic equipments of research and R&D laboratories and minor or major manufacturers of microelectronic and nanotechnology industry. This project should lead to taking out new patents (consolidation of intellectual property), licensing to interested suppliers, strengthening the start up Boreal Plasma created in 2005 and developing current and new industrial partnerships.

The APANAGE project will help achieving important technological breakthroughs in terms of industrial solutions and therefore offering competitive products and processes of different kinds: 1) advanced plasma technologies with higher performance than conventional technologies in terms of density, scaling up, flexibility; 2) standardized elementary plasma sources (for any configuration chamber) 3) plasma chambers ready for implementation on existing basic equipments; 4) deep etching process of polymers.

The expected results include, on one hand, the realization of a ultra high density plasma chamber (from 2 ? 1012 to 4 ? 1012 cm-3) using optimized elementary plasma sources, and, on the other hand the high aspect ratio etching process of polymers in order to exploit the achieved plasma performance for microelectronics and nanotechnology applications. These results will permit to win market parts in the sector of plasma equipments for microelectronics and nanotechnology industry.