New miniature high frequency probes for precision on-wafer microwave measurements – PRECISE

The very significant progress made on silicon technologies for millimetric applications makes possible
the development of new systems for 6G, medical imaging or automotive safety. Unfortunately, the
high frequency on-wafer characterization techniques required for the development of these
applications use patented probe technologies in the 2000s that have evolved so little. Unfortunately,
these commercial mmW probes have a strong coupling towards the substrate or towards the
neighborhood and thus alter the accuracy of the measurement beyond 50 GHz. Thus, in this project,
we propose to design miniaturized probes and manufacture them using MEMS-type silicon
technology to better confine the electromagnetic field. In addition, this probe will be broadband type
(DC-220/325 GHz) to adapt to new generations of network analyzer and will be more suitable for
precise characterization of mmW or THz application.