On-chip optiIcal inSulation for phOtonic circuits with non-reciprocaL YIG thin films – ISOLYIG

Optical Isolation (OI) is one of the corner stones in photonic circuits design. The need of this functionality will be even more striking for future complex applications where many laser diodes will be integrated on a single ship. In addition, future photonic integrated circuits will include many stages that will be cascaded to perform parallel and serial operations like modulation, amplification and detection. It will be mandatory to buffer those stages one from another by incorporating OI in between the stages. There is up today no industrial solution that allows for on-chip OI .
ISOLYIG aims to use new paradigms based on assembling magnetic materials (YIG) within photonic circuits using molecular bonding. We believe that the fundamental advances we already achieved will permit the fabrication of an economically relevant demonstrator of on-chip OI within the time frame of the ISOLYIG project.